Multilayer electronic component

ABSTRACT

A multilayer electronic component includes a body including a plurality of dielectric layers and first and second internal electrodes disposed alternately with the dielectric layers in a first direction; a first external electrode including a first connection electrode, disposed on the third surface, and a first band electrode disposed on the first surface to be connected to the first connection electrode; a second external electrode including a second connection electrode, disposed on the fourth surface, and a second band electrode disposed on the first surface to be connected to the second connection electrode; a first insulating layer disposed on the first connection electrode; a second insulating layer disposed on the second connection electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, The first and second band electrodes include a conductive metal and a resin.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2022-0017046 filed on Feb. 9, 2022 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a type of multilayer electroniccomponent, is a chip-type condenser mounted on the printed circuitboards of various types of electronic products such as an image displaydevice, for example, a liquid crystal display (LCD), a plasma displaypanel (PDP) or the like, computers, smartphones, and mobile phones, toserve to charge or discharge electricity therein or therefrom.

Such a multilayer ceramic capacitor may be used as a component ofvarious electronic devices due to having a relatively small size,relatively high capacitance, and relative ease of mounting. As variouselectronic devices such as computers, mobile devices, and the like areminiaturized and have high output, demand for decreasing the size andincreasing the capacitance of multilayer ceramic capacitors isincreasing. To decrease the size and increase the capacitance of themultilayer ceramic capacitor, it is necessary to mount as manycomponents as possible within a limited area of the substrate. To thisend, it is necessary to significantly reduce a mounting space.

With a recent development of wearable devices in the field ofinformation technology (IT), it is becoming important to guaranteebending strength. Accordingly, there is a need for an MLCC having anovel structure which may implement maximum capacitance within a limitedvolume to stably drive IT devices and may secure bending strength.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component having improved bending strength.

Another aspect of the present disclosure is to provide a multilayerelectronic component having improved capacitance per unit volume.

Another aspect of the present disclosure is to provide a multilayerelectronic component, capable of significantly reducing a mountingspace.

Another aspect of the present disclosure is to provide a multilayerelectronic component, capable of significantly reducing equivalentseries resistance (ESR).

Another aspect of the present disclosure is to provide a multilayerelectronic component, capable of significantly reducing acoustic noise.

However, the present disclosure is not limited thereto, and may be moreeasily understood in a process of describing exemplary embodiments inthe present disclosure.

According to another aspect of the present disclosure, a multilayerelectronic component includes a body including a plurality of dielectriclayers and first and second internal electrodes disposed alternatelywith the dielectric layers in a first direction and having first andsecond surfaces opposing each other in the first direction, third andfourth surfaces connected to the first and second surfaces and opposingeach other in a second direction, and fifth and sixth surfaces connectedto the first to fourth surfaces and opposing each other in a thirddirection; a first external electrode including a first connectionelectrode, disposed on the third surface, and a first band electrodedisposed on the first surface to be connected to the first connectionelectrode; a second external electrode including a second connectionelectrode, disposed on the fourth surface, and a second band electrodedisposed on the first surface to be connected to the second connectionelectrode; a first insulating layer disposed on the first connectionelectrode; a second insulating layer disposed on the second connectionelectrode; a first plating layer disposed on the first band electrode;and a second plating layer disposed on the second band electrode. Thefirst and second band electrodes include a conductive metal and a resin.

According to another aspect of the present disclosure, a multilayerelectronic component includes: a body including a plurality ofdielectric layers and first and second internal electrodes disposedalternately with the dielectric layers in a first direction and havingfirst and second surfaces opposing each other in the first direction,third and fourth surfaces connected to the first and second surfaces andopposing each other in a second direction, and fifth and sixth surfacesconnected to the first to fourth surfaces and opposing each other in athird direction; a first external electrode including a first connectionelectrode, disposed on the third surface, and a first band electrodedisposed on the first surface to be connected to the first connectionelectrode; a second external electrode including a second connectionelectrode, disposed on the fourth surface, and a second band electrodedisposed on the first surface to be connected to the second connectionelectrode; a first plating layer disposed on the first externalelectrode; and a second plating layer disposed on the second externalelectrode. The first and second band electrodes include a conductivemetal and a resin.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is a schematic perspective view of a body of the multilayerelectronic component of FIG. 1 .

FIG. 3 is an exploded perspective view of the body of FIG. 2 .

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 5 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 4 to which a solder and an electrode pad are added.

FIG. 6 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 6 .

FIG. 8 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 7 to which a solder and an electrode pad are added.

FIG. 9 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 9 .

FIG. 11 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 10 to which a solder and an electrode pad are added.

FIG. 12 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 13 is a cross-sectional view taken along line IV-IV′ of FIG. 12 .

FIG. 14 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 15 is a cross-sectional view taken along line V-V′ of FIG. 14 .

FIG. 16 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 17 is a cross-sectional view taken along line VI-VI′ of FIG. 16 .

FIG. 18 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 19 is a cross-sectional view taken along line VII-VII′ of FIG. 18 .

FIG. 20 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 19 to which a solder and an electrode pad are added.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified intovarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to the ordinary artisan. Therefore, shapes andsizes of the elements in the drawings may be exaggerated for clarity ofdescription, and the elements denoted by the same reference numerals inthe drawings may be the same elements.

In the drawings, portions not related to the description will be omittedfor clarification of the present disclosure, and a thickness may beenlarged to clearly illustrate layers and regions. The same referencenumerals will be used to designate the same components in the samereference numerals. Further, throughout the specification, when anelement is referred to as “comprising” or “including” an element, itmeans that the element may further include other elements as well,without departing from the other elements, unless specifically statedotherwise.

The term “an exemplary embodiment” used herein does not refer to thesame exemplary embodiment, and is provided to emphasize a particularfeature different from that of another exemplary embodiment. However,exemplary embodiments provided herein may be implemented by beingcombined in whole or in part one with one another. For example, oneelement described in a particular exemplary embodiment may be understoodas a description related to another exemplary embodiment even if it isnot described in another exemplary embodiment, unless an opposite orcontradictory description is provided therein.

In the drawings, a first direction may be defined as a stackingdirection or a thickness (T) direction, a second direction may bedefined as a length (L) direction, and a third direction may be definedas a width (W) direction.

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is a schematic perspective view of a body of the multilayerelectronic component of FIG. 1 .

FIG. 3 is an exploded perspective view of the body of FIG. 2 .

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 5 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 4 to which a solder and an electrode pad are added.

FIG. 6 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 6 .

FIG. 8 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 7 to which a solder and an electrode pad are added.

FIG. 9 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 9 .

FIG. 11 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 10 to which a solder and an electrode pad are added.

FIG. 12 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 13 is a cross-sectional view taken along line IV-IV′ of FIG. 12 .

FIG. 14 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 15 is a cross-sectional view taken along line V-V′ of FIG. 14 .

FIG. 16 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 17 is a cross-sectional view taken along line VI-VI′ of FIG. 16 .

FIG. 18 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment in the presentdisclosure.

FIG. 19 is a cross-sectional view taken along line VII-VII′ of FIG. 18 .

FIG. 20 is a schematic cross-sectional view of a multilayer electroniccomponent of FIG. 19 to which a solder and an electrode pad are added.

Hereinafter, a multilayer electronic component 2000 according to anexemplary embodiment will be described with reference to FIGS. 1 to 5 .

The multilayer electronic component 2000 according to an exemplaryembodiment may include a body including a plurality of dielectric layers111 and first and second internal electrodes 121 and 122 disposedalternately with the dielectric layers 111 in a first direction andhaving first and second surfaces 1 and 2 opposing each other in thefirst direction, third and fourth surfaces 3 and 4 connected to thefirst and second surfaces 1 and 2 and opposing each other in a seconddirection, and fifth and sixth surfaces 5 and 6 connected to the firstto fourth surfaces 1, 2, 3, and 4 and opposing each other in a thirddirection, a first external electrode 231 including a first connectionelectrode 231 a disposed on the third surface 3 and a first bandelectrode 231 b disposed on the first surface 1 to be connected to thefirst connection electrode 231 a, a second external electrode 232including a second connection electrode 232 a disposed on the fourthsurface 4 and a second band electrode 232 b disposed on the secondsurface to be connected to the second connection electrode 232 a, afirst insulating layer 251 disposed on the first connection electrode231 a, a second insulating layer 252 disposed on the second connectionelectrode 232 a, a first plating layer 241 disposed on the first bandelectrode 231 b, and a second plating layer 242 disposed on the secondband electrode 232 b. The first and second band electrodes 231 b and 232b may include a conductive metal and a resin.

In the body 110, the dielectric layers 111 and the internal electrodes121 and 122 may be alternately laminated.

A shape of the body 110 is not particularly limited, and may be ahexahedral shape or a shape similar to the hexahedral shape, asillustrated in the drawings. Although the body 110 does not have ahexahedral shape having perfectly straight lines due to shrinkage ofceramic powder particles included in the body 110 in a sinteringprocess, the body 110 may have a substantially hexahedral shape.

The body 110 may have first and second surfaces 1 and 2 opposing eachother in the first direction, third and fourth surfaces 3 and 4connected to the first and second surfaces 1 and 2 and opposing eachother in the second direction, and fifth and sixth surfaces 5 and 6connected to the first to fourth surfaces 1, 2, 3, and 4 and opposingeach other in the third direction.

The plurality of dielectric layers 111 constituting the body 110 may bein a sintered state, and adjacent dielectric layers 111 may beintegrated with each other such that boundaries therebetween are notreadily apparent without using a scanning electron microscope (SEM).

A material of the dielectric layer 111 may not be limited to anyparticular material as long as sufficient capacitance is able to beobtained therewith. For example, as the material, a barium titanatematerial, a perovskite material compound with lead (Pb), a strontiumtitanate material, or the like, may be used. The barium titanatematerial may include BaTiO₃-based ceramic powder particles, and anexample of the ceramic powder particles may include BaTiO₃,(Ba_(1-x)Ca_(x))TiO₃ (0<x<1), Ba(Ti_(1-y)Ca_(y))O₃ (0<y<1),(Ba_(1-x)Ca_(x))(Ti_(1-y)Zr_(y))O₃ (0<x<1, 0<y<1), Ba(Ti_(1-y)Zr_(y))O₃(0<y<1), or the like, in which calcium (Ca), zirconium (Zr), and thelike, are partially solid-solute in BaTiO₃, or the like.

As the material of the dielectric layer 111, various ceramic additives,organic solvents, plasticizers, coupling agents, dispersants, and thelike, may be added to powder particles such as barium titanate (BaTiO₃)powder particles, or the like, depending on an intended purpose.

An average thickness td of the dielectric layer 111 does not need to belimited.

In general, when the dielectric layer 111 is formed to have a lowthickness of less than 0.6 μm, in particular, when the dielectric layer111 is formed to have a thickness of less than 0.35 μm, reliability maybe deteriorated.

According to an exemplary embodiment, the insulating layers 251 and 252may be disposed on the connection electrodes 231 a and 232 a of theexternal electrodes 231 and 232, and the plating layers 241 and 242 maybe disposed on the band electrodes 231 b and 232 b of the externalelectrodes 231 and 232, so that permeation of external moisture,permeation of a plating solution, or the like, may be prevented toimprove reliability. Therefore, even when the average thickness of thedielectric layer 111 is 0.35 μm or less, improved reliability may besecured.

The average thickness td of the dielectric layer 111 may refer to anaverage thickness of the dielectric layer 111 disposed between the firstand second internal electrodes 121 and 122.

An average thickness td of the dielectric layer 111 may be measured byscanning the cross-sections in the first and second directions (lengthand thickness directions, an L-T plane) of the body 110 with a scanningelectron microscope (SEM) with a magnification of 10,000. For example,an average value thereof may be determined by measuring a thickness of asingle dielectric layer at thirty (30) equally spaced points in thelength direction in the scanned image. The thirty (30) equally spacedpoints may be designated in an active portion Ac. In addition, when suchan average value is determined using measurements of average values toten (10) dielectric layers, the average thickness td of the dielectriclayer 111 may be more generalized.

The body 110 may include an active portion Ac disposed in the body 110and including the first internal electrode 121 and the second internalelectrode 122, disposed to oppose each other with the dielectric layer111 interposed therebetween to form capacitance, and cover portions 112and 113 disposed above and below the active portion Ac in the firstdirection.

The active portion Ac may be a portion contributing to capacitanceformation of the multilayer electronic component, and may be formed byrepeatedly laminating the plurality of first and second internalelectrodes 121 and 122 with the dielectric layer 111 interposedtherebetween.

The cover portions 112 and 113 may include an upper cover portion 112,disposed above the active portion Ac in the first direction, and a lowercover portion 113 disposed below the active portion Ac in the firstdirection.

The upper cover portion 112 and the lower cover portion 113 may beformed by laminating a single dielectric layer or two or more dielectriclayers on the upper and lower surfaces of the active portion Ac in thefirst direction (thickness direction), respectively, and may basicallyserve to prevent damage to the internal electrode caused by chemicalstress.

The upper cover portion 112 and the lower cover portion 113 may notinclude an internal electrode and may include the same material as thedielectric layer 111. For example, the upper cover portion 112 and thelower cover portion 113 may include a ceramic material, for example, abarium titanate (BaTiO₃)-based ceramic material.

An average thickness tc of the cover portions 112 and 113 does not needto be limited. However, the average thickness tc of the cover portions112 and 113 may be 15 μm or less to more easily achieve miniaturizationand high capacitance of the multilayer electronic component. Inaddition, according to an exemplary embodiment, insulating layers 251and 252 may be disposed on the connection electrodes 231 a and 232 a ofthe external electrodes 231 and 232, and the plating layers 241 and 242may be formed on the band electrodes 231 b and 232 b of the externalelectrodes 231 and 232 to prevent permeation of external moisturepenetration, permeation of a plating solution penetration, and/or thelike, thereby improving reliability. Therefore, even when the averagethickness tc of the cover portions 112 and 113 is 15 μm or less,improved reliability may be secured.

The average thickness tc of the cover portions 112 and 113 may refer toan average size in the first direction, and may be an average of valuesmeasured at five (5) equally spaced points above or below the activeportions Ac in the first direction.

The margin portions 114 and 115 may be disposed on opposite end surfacesof the active portion Ac in the third direction.

The margin portions 114 and 115 may include a first margin portion 114,disposed on the fifth surface 5 of the body 110, and a second marginportion 115 disposed on the sixth surface 6 of the body 110. Forexample, the margin portions 114 and 115 may be disposed on opposite endsurfaces of the ceramic body 110 in the third direction (the widthdirection).

As illustrated in FIG. 2 , the margin portions 114 and 115 may refer toregions between both side surfaces of the first and second internalelectrodes 121 and 122, and an external surface of the body 110, in across-section of the body 110 cut in the first and third directions (thethickness and width directions, W-T direction) and a boundary surface ofthe body 110.

The margin portions 114 and 115 may basically play a role in preventingdamage to the internal electrodes caused by physical or chemical stress.

The margin portions 114 and 115 may be formed by forming the internalelectrodes 121 and 122 by applying a conductive paste on the ceramicgreen sheet, except for a portion in which the margin portions 114 and115 are to be formed.

To suppress the step difference caused by the internal electrodes 121and 122, the internal electrodes 121 and 122 may be cut to be exposed tothe fifth and sixth surfaces 5 and 6 of the body 110 after lamination.Then, the margin portions 114 and 115 may be formed by laminating asingle dielectric layer 111 or two or more dielectric layers 111 onopposite side surfaces of the active portion Ac in the third direction(the width direction).

The average width of the margin portions 114 and 115 does not need to belimited. However, the average width of the margin portions 114 and 115may be 15 μm or less to more easily achieve miniaturization and highcapacitance of the multilayer electronic component. In addition,according to an exemplary embodiment, insulating layers 251 and 252 maybe disposed on the connection electrodes 231 a and 231 a of the externalelectrodes 231 and 232, and the plating layers 241 and 242 may be formedon the band electrodes 231 b and 232 b of the external electrodes 231and 232 to prevent permeation of external moisture penetration,permeation of a plating solution penetration, and/or the like, therebyimproving reliability. Therefore, even when the average width of themargin portions 114 and 115 is 15 μm or less, improved reliability maybe secured.

The average width of the margin portions 114 and 115 may refer to anaverage size of the margin portions 114 and 115 in the third direction,and may be an average value of sizes of the margin portions 114 and 115measured at five equally spaced five points on a side surface of theactive portion Ac in the third direction.

The internal electrodes 121 and 122 may be laminated with the dielectriclayer 111.

The internal electrodes 121 and 122 may include first and secondinternal electrodes 121 and 122. The first and second internalelectrodes 121 and 122 may be alternately disposed to oppose each otherwith the dielectric layer 111, constituting the body 110, interposedtherebetween, and may be exposed to the third and fourth surfaces 3 and4 of the body 110, respectively.

Referring to FIG. 4 , the first internal electrode 121 may be spacedapart from the fourth surface 4 and may be exposed from the thirdsurface 3, and the second internal electrode 122 may be spaced apartfrom the third surface 3 and may be exposed from the fourth surface 4.The first external electrode 231 may be disposed on the third surface 3of the body 110 to be connected to the first internal electrode 121, andthe second external electrode 232 may be disposed on the fourth surface4 of the body 110 to be connected to the second internal electrode 122.

For example, the first internal electrode 121 may not be connected tothe second external electrode 232 but may be connected to the firstexternal electrode 231, and the second internal electrode 122 may not beconnected to the first external electrode 231 but may be connected tothe second external electrode 232. Accordingly, the first internalelectrode 121 may be formed to be spaced apart from the fourth surface 4by a predetermined distance, and the second internal electrode 122 maybe formed to be spaced apart from the third surface 3 by a predetermineddistance.

In this case, the first and second internal electrodes 121 and 122 maybe electrically separated from each other by the dielectric layer 111interposed therebetween.

The body 110 may be formed by alternately laminating a ceramic greensheet, on which the first internal electrode 121 is printed, and aceramic green sheet, on which the second internal electrode 122 isprinted, and then sintering the laminated ceramic green sheets.

A material for forming the internal electrodes 121 and 122 is notlimited, and a material having excellent electrical conductivity may beused. For example, the internal electrodes 121 and 122 may include atleast one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold(Au), platinum (Pt), tin (Sn), or tungsten (W)), titanium (Ti), andalloys thereof.

In addition, the internal electrodes 121 and 122 may be formed byprinting a conductive paste for the internal electrodes containing oneor more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold(Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloysthereof, on the ceramic green sheets. As a printing method of theconductive paste for the internal electrodes, a screen-printing method,a gravure printing method, or the like may be used, but exemplaryembodiments are not limited thereto.

An average thicknesses te of the internal electrodes 121 and 122 doesnot need to be limited.

In general, when an internal electrode is formed as a thin film having athickness of less than 0.6 μm, in particular, when the thickness of theinternal electrode is 0.35 μm or less, reliability may be deteriorated.

However, according to an exemplary embodiment, the insulating layers 251and 252 may be disposed on the connection electrodes 231 a and 232 a ofthe external electrodes 231 and 232, and the plating layers 241 and 232may be disposed on the band electrodes 231 b and 232 b of the externalelectrodes 231 and 232 to prevent permeation of external moisture,permeation of a plating solution, and/or the like, thereby improvingreliability. Therefore, even when the average thickness of the internalelectrodes 121 and 122 is 0.35 μm or less, improved reliability may besecured.

The average thickness te of each of the internal electrodes 121 and 122may be measured by scanning the cross-sections in the first and seconddirections (length and thickness directions, an L-T plane) of the body110 with a scanning electron microscope (SEM) with a magnification of10,000. For example, an average value thereof may be determined bymeasuring a thickness of one (1) internal electrode at thirty (30)equally spaced points in the second direction (the length direction) inthe scanned image. The thirty (30) equally spaced points may bedesignated in the active portion Ac. In addition, when such an averagevalue is determined using measurements of average values to ten (10)internal electrodes, the average thickness to of the internal electrodemay be more generalized.

In the exemplary embodiment, a structure in which the ceramic electroniccomponent 2000 has two external electrodes 231 and 232 has beendescribed. However, the number and shape of the external electrodes 231and 232 may vary depending on the shape of the internal electrodes 121and 122 or other purposes. This will be equally applied to ceramicelectronic components 2001, 2002, 2003, 2004, 2005, and 2006 describedbelow.

The external electrodes 231 and 232 may be disposed on the third surface3 and the fourth surface 4 of the body 110. The external electrodes 231and 232 may include first and second external electrodes 231 and 232,respectively disposed on the third and fourth surfaces 3 and 4 of thebody 110 to be connected to the first and second internal electrodes 121and 122.

The external electrodes 231 and 232 may be formed of any material aslong as they have electrical conductivity, such as a metal, and specificmaterials may be determined in consideration of electricalcharacteristics, structural stability, or the like, and further may havea multilayer structure.

The external electrodes 231 and 232 may be sintered electrodes includinga conductive metal and a glass, or resin-based electrodes including aconductive metal and a resin.

In addition, the external electrodes 231 and 232 may be in a form inwhich a sintering electrode and a resin-based electrode are sequentiallyformed on the body 110. In addition, the external electrodes 231 and 232may be formed by transferring a sheet including a conductive metal ontothe body 110 or by transferring a sheet including a conductive metalonto a sintering electrode.

As a conductive metal included in the external electrodes 231 and 232, amaterial having improved electrical conductivity may be used, andexemplary embodiments are not limited thereto. For example, theconductive metal may be one or more of copper (Cu), nickel (Ni),palladium (Pd), silver (Ag), tin (Sn), chromium (Cr), and alloysthereof. The external electrodes 231 and 232 may include at least oneof, in detail, Ni and a Ni-alloy. Accordingly, connectivity to theinternal electrodes 121 and 122 including Ni may be further improved.

As a more detailed example, the external electrodes 231 and 232 mayinclude a first external electrode 231, including a first connectionelectrode 231 a disposed on the third surface 3 and a first bandelectrode 231 b extending from the first connection electrode 231 a to aportion of the first surface 1, and a second external electrode 232including a second connection electrode 232 a disposed on the fourthsurface 4 and a second band electrode 232 b extending from the secondconnection electrode 232 a to a portion of the first surface 1. Thefirst connection electrode 231 a may be connected to the first internalelectrode 121 on the third surface 3, and the second connectionelectrode 232 a may connected to the second internal electrode 122 onthe fourth surface 4.

In this case, the connection electrodes 231 a and 232 a may include aconductive metal and a glass. The conductive metal may use a materialhaving improved electrical conductivity as described above, and mayinclude one or more of, for example, Cu, Ni, Pd, Ag, Sn, Cr, and alloysthereof, but exemplary embodiments are not limited thereto.

The first external electrode 231 may include a first band electrode 231b disposed on the first surface 1 to be connected to the firstconnection electrode 231 a, and the second external electrode 232 mayinclude a second band electrode 232 b disposed on the first surface 1 tobe connected to the second connection electrode 232 a.

With a recent technological development of wearable devices and anincreasing demand for the wearable devices in the field of informationtechnology (IT), it is becoming important to guarantee bending strength.Accordingly, there is a need for an MLCC having a novel structure whichmay implement maximum capacitance within a limited volume to stablydrive IT devices and may secure bending strength. In addition, to mountas many components as possible within a limited area of a substrate, itis necessary to significantly reduce a volume occupied by an electrodepad and a solder of the substrate. To this end, there have been attemptsto significantly reduce a space by developing an L-shaped electrode, orthe like. However, an L-shaped electrode, or the like, is vulnerable toexternal stress.

For this reason, according to an exemplary embodiment, a band electrodemay include a resin, so that a multilayer electronic component highlyresistant to external stress may be provided and a size thereof may bereduced.

For example, a resin may be included in the band electrode disposed onthe first surface, so that stress may be applied to the multilayerelectronic component by expansion and contraction of a solder during asolder reflow process. The resin included in the band electrode mayalleviate such stress. In addition, the resin included in the bandelectrode may alleviate bending stress, which may be applied to themultilayer electronic component when a substrate is deformed, to preventcracking or delamination from occurring.

The “solder reflow” refers to a process in which, when a lead paste isapplied and then heat is applied, the lead paste surrounds theelectrodes to dispose a multilayer electronic component and tosimultaneously connect an electrode to an electrode. For example, the“solder reflow” is a process performed when mounting the multilayerelectronic component.

When a multilayer electronic component according to an exemplaryembodiment is mounted, the solder reflow may be performed at a reflowtemperature ranging from 240° C. or more to 270° C. or less, butexemplary embodiments are not limited thereto. In general, when thereflow temperature is high, probability of occurrence of cracking of themultilayer electronic component is increased. This means that, asheating and cooling are performed during the reflow process, the greatera temperature difference, the higher stress applied to the multilayerelectronic component. To address such an issue, a resin may be includedin a band electrode to alleviate stress which may be applied to themultilayer electronic component, as will described below.

The band electrodes 231 b and 232 b may include a conductive metal and aresin. As the conductive metal, a material having improved electricalconductivity may also be used. The conductive metal may include at leastone of, for example, Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof, butexemplary embodiments are not limited thereto.

The resin may include at least one selected from the group consisting ofan epoxy resin, an acrylic resin, and ethyl cellulose, but exemplaryembodiments are not limited thereto.

The above-mentioned resin may be included in the band electrode toalleviate stress which may be applied to a multilayer electroniccomponent, and thus, cracking or delamination may be prevented fromoccurring. As a result, a multilayer electronic component resistant tobending stress and having improved reliability may be provided.

The insulating layers 251 and 252 may be disposed on the connectionelectrodes 231 a and 232 a.

As a more detailed example, the first insulating layer 251 may bedisposed on the first connection electrode 231 a, and the secondinsulating layer 252 may be disposed on the second connection electrode232 a.

Since the first and second connection electrodes 231 a and 232 a areportions connected to the internal electrodes 121 and 122, they may be apath through which a plating solution permeates in a plating process ormoisture permeates during actual use. In the present disclosure, theinsulating layers 251 and 252 may be disposed on the connectionelectrodes 231 a and 232 a to prevent permeation of external moisture ora plating solution.

The insulating layers 251 and 252 may be disposed to be in contact withthe plating layers 241 and 242.

As a more detailed example, the first insulating layer 251 may bedisposed to be in contact with the first plating layer 241, and thesecond insulating layer 252 may be disposed to be in contact with thesecond plating layer 242.

In this case, the first insulating layer 251 may be in contact with aportion of a distal end of the first plating layer 241 while coveringthe potion of the distal end, or the second insulating layer 252 may bein contact with a portion of a distal end of the second plating layer242 while covering the portion of the distal end.

The insulating layers 251 and 252 may serve to prevent the platinglayers 241 and 242 from being formed on the external electrodes 231 and232 on which the insulating layers 251 and 252 are disposed, and mayserve to improve sealing characteristics to significantly reducepermeation of external moisture, an external plating solution, or thelike.

On the other hand, the first plating layer 241 may be in contact with aportion of a distal end of the first insulating layer while covering theportion of the distal end, or the second plating layer 242 may be incontact with a portion of a distal end of the second insulating layer252 while covering the portion of the distal end.

Before the plating layers 241 and 242 are formed on the externalelectrodes 231 and 232, the insulating layers 251 and 252 may be formedto more reliably suppress the permeation of the plating solution duringformation of a plating layer. For example, the insulating layers 251 and252 may be formed before formation of the plating layers 241 and 242 tosuppress the permeation of the plating solution, so that the platinglayers 241 and 242 may have a shape covering the distal ends of theinsulating layers 251 and 252.

In addition, when the laminated electronic component 2000 is mounted ona substrate (not illustrated), the insulating layers 251 and 252 may beformed on the external electrodes 231 and 232 to significantly reduce amounting space.

The insulating layers 251 and 252 may include a resin and an additive.

The resin may be at least one selected from the group consisting of anepoxy resin, an acrylic resin, and ethyl cellulose, but exemplaryembodiments are not limited thereto.

The additive may be at least one selected from the group consisting ofSiO₂, TiO₂, BaTiO₃, BaO, Al₂O₃, and ZnO, but exemplary embodiments arenot limited thereto.

An average thickness of the insulating layers 251 and 252 may be 500 nmor more and 1000 nm or less.

When the average thickness of the insulating layers 251 and 252 is lessthan 500 nm, the insulating layers 251 and 252 may not block moisture,so that moisture resistance reliability of the multilayer electroniccomponent may not be secured. When the average thickness of theinsulating layers 251 and 252 is greater than 1000 nm, it may bedifficult to significantly reduce capacitance per unit volume of themultilayer electronic component because a proportion of the insulatinglayers 251 and 252 is excessive.

The average thickness of the insulating layers 251 and 252 may be anaverage of thickness values of the insulating layers 251 and 252measured at a center point of the first and second connection electrodes231 a and 232 a in the first direction, two points spaced apart from thecenter point by 5 μm, and two points spaced apart from the center pointby 10 μm. In this case, the average thickness of the insulating layers251 and 252 may refer to an average size thereof in the first direction.

The plating layers 241 and 242 may be disposed on the band electrodes231 b and 232 b.

As a more detailed example, the first plating layer 241 may be disposedon the first band electrode 231 b, and the second plating layer 242 maybe disposed on the second band electrode 232 b.

The plating layers 241 and 242 may serve to improve mountingcharacteristics. As the plating layers 241 and 242 are disposed on theband electrodes 231 b and 232 b, the mounting space may be significantlyreduced and permeation of the plating solution into the internalelectrode 121 and 122 may be significantly reduced to improvereliability. One distal end of the first plating layer 241 may be incontact with the first surface 1, and the other distal end thereof maybe in contact with the first insulating layer 251. One distal end of thesecond plating layer 242 may be in contact with the first surface 1, andthe other distal end thereof may be in contact with the secondinsulating layer 252. Such a continuous structure of the continuousplating layers 241 and 242 may be helpful in reducing equivalent seriesresistance (ESR) of the multilayer electronic component.

The type of the plating layers 241 and 242 does not need to be limited,and each of the plating layers 241 and 242 may be a plating layerincluding at least one of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof andmay include a plurality of layers.

As a more detailed example of the plating layers 241 and 242, theplating layers 241 and 242 may be a Ni-plating layer or a Sn-platinglayer, and may be in a form in which a Ni-plating layer and a Sn-platinglayer are sequentially formed on the first and second band electrodes231 b and 232 b.

In an exemplary embodiment, the first insulating layer 251 may disposedto cover a distal end of the first plating layer 241 disposed on thefirst external electrode 231, and the second insulating layer 242 may bedisposed to cover a distal end of the second plating layer 242 disposedon the external electrode 232.

Before the plating layers 241 and 242 are formed on the externalelectrodes 231 and 232, insulating layers 251 and 252 may be formed tomore reliably suppress permeation of the plating solution duringformation of a plating layer. In addition, bonding force between theinsulating layers 251 and 252 and the plating layers 241 and 242 may beincreased to improve the reliability of the multilayer electroniccomponent.

Referring to FIG. 5 , the plating layers 241 and 242 of the multilayerelectronic component 2000 may be bonded to the electrode pads 181 and182 disposed on a substrate (not shown) by solders 191 and 192.

In an exemplary embodiment, H2≤H1, where H1 is an average size to aninternal electrode, disposed to be closest to the first surface 1 in thefirst direction, among the first and second internal electrodes 121 and122, and H2 is an average size from an extension line of the firstsurface 1 to distal ends of the first and second plating layers 241 and242, disposed on the first and second connection electrodes 231 a and232 a, in the first direction.

Accordingly, solders 191 and 192 required to mount the multilayerelectronic component 2000 on the substrate may be significantly reduced,so that a mounting space may be reduced, a purpose of reducing ESR, apurpose of the multilayer electronic component 2000, may be achieved,and permeation of a plating solution into the internal electrodes 121and 122 during a plating process may be suppressed to improvereliability.

Each of H1 and H2 may be an average of values measured in across-section (an L-T cross-section) of a body 110, taken in the firstand second directions (thickness and length directions), at five (5)points equally spaced apart from each other in a third direction (awidth direction). H1 may be an average of values measured at points, atwhich an internal electrode disposed to be closest to the first surface1 is connected to an external electrode, in respective cross-sections.H2 may be an average of values measured based on distal ends of theplating layers 241 and 242 in contact with the external electrode.Extension lines of the first surface, a reference for measurement of H1and H2, may be the same.

Hereinafter, a multilayer electronic component 2001 according to anexemplary embodiment will be described with reference to FIGS. 6 to 8 .

Referring to FIGS. 6 and 7 , the multilayer electronic component 2001according to an exemplary embodiment may include first and secondplating layers 241-1 and 242-1 formed on a level the same as or lowerthan a level of an extension line E1 of a first surface.

Accordingly, referring to FIG. 8 , heights of the solders 191-1 and192-1 may be decreased during mounting, and spaces of the electrode pads181-1 and 182-1 may be reduced to significantly reduce a mounting space.

In addition, insulating layers 251-1 and 252-1 may extend to a portion,disposed on a level the same as or lower than a level of the extensionline E1 of the first surface, to be in contact with the first and secondplating layers 241-1 and 242-1.

Hereinafter, a multilayer electronic component 2002 according to anexemplary embodiment will be described with reference to FIGS. 9 to 11 .

Referring to FIGS. 9 and 10 , in the laminated electronic component 2002according to an embodiment of the present invention, H2>H1, where H1 isan average size to an internal electrode, disposed to be closest to afirst surface 1 in a first direction, among first and second internalelectrodes 121 and 122, and H2 is an average size from an extension lineE1 of the first line 1 to distal ends of first and second plating layers241-1 and 242-2, disposed on first and second connection electrodes 231a and 232 a, in the first direction.

Accordingly, referring to FIG. 11 , when a mounting space does not needto be reduced, first and second insulating layers 251-2 and 252-2 may besignificantly reduced to decrease ESR and a multilayer electroniccomponent 2002 according to an exemplary embodiment is effective inachieving the purpose when low ESR is required.

Each of H1 and H2 may be an average of values measured in across-section (an L-T cross-section) of a body 110, taken in first andsecond directions (thickness and length directions), at five (5) pointsequally spaced apart from each other in a third direction (a widthdirection). H1 may be an average of values measured at points, at whichan internal electrode disposed to be closest to the first surface 1 isconnected to an external electrode, in respective cross-sections. H2 maybe an average of values measured based on distal ends of the platinglayers 241-1 and 242-2 respectively in contact with the first and secondinsulating layers 251-2 and 252-2. Extension lines of the first surface,a reference for measurement of H1 and H2, may be the same.

Referring to FIGS. 18 to 20 , a multilayer electronic component 2006according to an exemplary embodiment may include a body including aplurality of dielectric layers 111 and first and second internalelectrodes 121 and 122 disposed alternately with the dielectric layers111 in a first direction and having first and second surfaces 1 and 2opposing each other in the first direction, third and fourth surfaces 3and 4 connected to the first and second surfaces 1 and 2 and opposingeach other in a second direction, and fifth and sixth surfaces 5 and 6connected to the first to fourth surfaces 1, 2, 3, and 4 and opposingeach other in a third direction, a first external electrode 231including a first connection electrode 231 a disposed on the thirdsurface 3 and a first band electrode 231 b disposed on the first surface1 to be connected to the first connection electrode 231 a, a secondexternal electrode 232 including a second connection electrode 232 adisposed on the fourth surface 4 and a second band electrode 232 bdisposed on the second surface 2 to be connected to the secondconnection electrode 232 a, a first plating layer 241-3 disposed on thefirst external electrode 231, and a second plating layer 242-3 disposedon the second external electrode 232. The first and second bandelectrodes 231 b and 232 b may include a conductive metal and a resin.

In the multilayer electronic component 2006, descriptions of the sameconfigurations as described above will be omitted.

Referring to FIGS. 18 and 19 , plating layers 241-3 and 242-3 may bedisposed to cover the entire external electrodes 231 and 232, so thatthe insulating layers 251 and 252 may not be formed.

Accordingly, referring to FIG. 20 , when a mounting space does not needto be reduced, the purpose may be achieved in the case in which minimumESR is required.

Hereinafter, a multilayer electronic component 2003 according to anexemplary embodiment will be described with reference to FIGS. 12 and 13.

According to the multilayer electronic component 2003, the firstexternal electrode 231 may further include a third connection electrode231 c disposed on the third surface 3 to be disposed on the firstconnection electrode 231 a, the second external electrode 232 mayfurther include a fourth connection electrode 232 c disposed on thefourth surface 4 to be disposed on the second connection electrode 232a, the first insulating layer 251 may be disposed on the thirdconnection electrode 232 c, and the second insulating layer 252 may bedisposed on the fourth connection electrode 232 c.

The third and fourth connection electrodes 231 c and 232 c may include aconductive metal. The conductive metal may be at least one of Cu, Ni,Pd, Ag, Sn, Cr, and alloys thereof. As described above, the third andfourth connection electrodes 231 c and 232 c may be formed of anymaterial as long as it has electrical conductivity, and a specificmaterial may be determined in consideration of electricalcharacteristics, structural stability, and the like.

In this case, main components referring to components, included in alargest amount, of the conductive metal included in the first connectionelectrode 231 a and the third connection electrode 231 c, may bedifferent from each other. Similarly, main components of the conductivemetal included in the second connection electrode 232 a and the fourthconnection electrode 232 c may be different from each other.

The third connection electrode 231 c disposed on the first connectionelectrode 231 a and the fourth connection electrode 232 c disposed onthe second connection electrode 232 a may include glass, but exemplaryembodiments are not limited thereto.

The third and fourth connection electrodes 231 c and 232 c may beapplied to all of the multilayer electronic components 2000, 2001, 2002,2004, 2005, and 2006 described herein, as necessary.

Hereinafter, multilayer electronic components 2004 and 2005 according toan exemplary embodiment will be described with reference to FIGS. 14 to17 .

Referring to FIGS. 14 and 15 , the multilayer electronic component 2004according to an exemplary embodiment may further include an additionalinsulating layer 261 disposed on a first surface and disposed between afirst band electrode 231 b and a second band electrode 232 b.

As plating layers 241 and 242 and insulating layers 251 and 252 aredisposed on external electrodes 231 and 232, the amount of solders 181and 182 may be insufficient, so that bonding force to a substrate (notillustrated) may be reduced. In this case, to secure adhesion strengthof the multilayer electronic component, the first and second bandelectrodes 231 b and 232 b in a second direction (a length direction)may be formed to have a significantly large size, so that an area inwhich the multilayer electronic component 2004 is connected to thesolder 181 and 182 may be significantly increased to supplement theimprovement of the adhesion strength.

In this case, since a distance between the band electrodes 231 b and 232b or the plating layers 241 and 242 is too close under a high-voltageoperating condition, insulation breakdown may occur. To prevent theinsulation breakdown from occurring, an additional insulating layer 261may be formed between the first and second band electrodes 231 b and 232b to prevent leakage current, or the like.

Referring to FIGS. 16 and 17 , a multilayer electronic component 2005according to an exemplary embodiment may further include an additionalinsulating layer 261-1 disposed on a first surface 1, and first andsecond band electrodes 231 b and 232 b may be disposed on the additionalinsulating layer 261-1.

The additional insulating layer 261-1 may alleviate stress transmittedto the multilayer electronic component 2005 through the first and secondband electrodes 231 b and 232 b, and may reduce vibration generated fromthe multilayer electronic component 2005 and increase a distance betweena substrate (not illustrated) and the multilayer electronic component2005 to significantly reduce acoustic noise.

The additional insulating layers 261 and 261-1 may include a resin andan additive, but do not need to have the same composition as thoseincluded in the first and second insulating layers 251 and 252 and mayhave a composition, different from a composition of those included inthe first and second insulating layers 251 and 252.

In this case, the resin included in the additional insulating layers 261and 261-1 may include at least one selected from an epoxy resin, anacrylic resin, and ethyl cellulose, and the additive included in theadditional insulating layers 261 and 261-1 may include at least oneselected from SiO₂, TiO₂, BaTiO₃, BaO, Al₂O₃, and ZnO.

The additional insulating layers 261 and 261-1 may be applied to all ofthe multilayer electronic components 2000, 2001, 2002, and 2003described herein, as necessary.

Sizes of the multilayer electronic components 2000, 2001, 2002, 2003,2004, 2005, and 2006 do not need to be limited.

To simultaneously achieve miniaturization and high capacitance, thenumber of laminated layers should be increased by reducing thethicknesses of dielectric layers and internal electrodes. Therefore, aneffect of improving reliability and capacitance per unit volume may bemore prominent in a multilayer electronic component having a size of1005 (length×width, 1.0 mm×0.5 mm) or less.

Hereinafter, the present disclosure will be described in detail throughexperimental examples, but the experimental examples are to help thespecific understanding of the present disclosure. Therefore, the scopeof the present disclosure is not limited thereto.

Experimental Example

When a band electrode including a resin is formed in a multilayerelectronic component 2000, stress applied to the multilayer electroniccomponent 2000 during a reflow process or deformation of a substrate maybe alleviated. Hereinafter, this will be described through experimentalexamples. In the present embodiment, data evaluated for the multilayerelectronic component 2000 are summarized and listed in tables, but aneffect of enhancing bending stress by forming a band electrode includinga resin, or the like, is not limited in only the present embodiment2000. In addition, an effect of enhancing bending stress to be describedlater, or the like, may be exhibited in all cases in which a bandelectrode including a resin is provided as a configuration.

Tables 1 to 3 are made by evaluating whether stress was alleviated bymeasuring whether cracking has occurred during a reflow process ordeformation of a substrate of the multilayer electronic component 2000including a band electrode including a resin.

The presence or absence of cracking was confirmed through a scanningelectron microscope (SEM), and accurate measurement positions are asfollows. A region of a straight line in a first direction (a thicknessdirection) was confirmed at points spaced apart by ¼, 2/4, and ¾ and aregion of a straight line in a third direction (a width direction) wasconfirmed at points spaced apart by ¼, 2/4, and ¾ in a cross-section (aW-T cross-section) taken in the first and third directions(thickness-width directions), based on a region between opposite distalends of the first and second internal electrodes and a boundary surfaceof a body. In the case in which cracking occurred in a correspondingregion, the case was determined to be defective.

Inventive Examples 1 to 3 correspond to multilayer electronic components(chips) in which a band electrode including a resin is formed. In thiscase, a conductive metal included in the band electrode was copper (Cu)and the resin was epoxy.

Comparative Examples 1 to 3 correspond to a case in which a bandelectrode was formed as a sintering electrode including a conductivemetal and a glass without including a resin. Similarly, the conductivemetal was Cu.

Table 1 illustrates evaluation of the degree of alleviation of stressapplied during a reflow process. In a detailed evaluation method, 10chips were mounted on a substrate and were then heated at 270° C., aharsh temperature condition, and naturally cooled to reflow. In thiscase, the heating and the natural cooling were repeated five times.Then, hot air was applied to the chips mounted on the substrate toremove the chips therefrom, and a determination was made as to whethercracking occurred in the above-mentioned region, through a SEM.

TABLE 1 Classification Frequency of Cracking Comparative Example 1 10/10Inventive Example 1  0/10

In Comparative Example 1, an external electrode, including a bandelectrode which does not include a resin, was formed, so that crackingoccurred in all of the ten chips due to stress applied during thereflow. Therefore, it may be evaluated that the stress applied to thechip were not reduced.

On the other hand, in Example 1, cracking did not occur in all of theten chips. Accordingly, it may be evaluated that the stress applied tothe chip was alleviated by a band electrode including a resin.

Table 2 illustrates evaluation of the degree of alleviation of stressduring deformation of a multilayer electronic component. According to adetailed evaluation method, ten chips were mounted on a substrate, and 4mm of deformation was then applied to the substrate. Then, hot air wasapplied to the chips mounted on the substrate to remove the chipstherefrom, and a determination was made as to whether cracking occurredin the above-mentioned region, through a SEM.

TABLE 2 Classification Frequency of Cracking Comparative Example 2 3/10Inventive Example 2 0/10

In Comparative Example 2, it may be confirmed that a band electrodewhich did not include a resin was formed, so that cracking occurred inthree chips, among the ten chips, due to stress generated when 4 mm ofdeformation was applied once.

On the other hand, in Inventive Example 2, cracking did not occur in allof the ten chips. Accordingly, it may be evaluated that stress wasalleviated even when deformation was applied to a chip by a bandelectrode including a resin.

Table 3 illustrates the degree of alleviation of bending stress througha moisture resistance reliability evaluation (8585 test). According to adetailed evaluation method, 66 chips were mounted on a substrate, anddeformation of 4 mm was applied the substrate five times. Then, avoltage of 1 VR was applied to the chip for 24 hours under conditions ofa temperature of 85° C. and relative humidity of 85%. In the case inwhich insulation resistance was decreased by more than 1/100 as comparedto the initial insulation resistance, a defect caused by IRdeterioration was determined to occur.

TABLE 3 Classification Frequency of Cracking Comparative Example 3 11/66Inventive Example 3  0/66

In comparative Example 3, it may be confirmed that a band electrodewhich did not include a resin was formed, so that an IR deteriorationdefect occurred in eleven (11) chip, among the 66 chips, when 4 mm ofdeformation was applied five times. From this, it may be confirmed thatmoisture resistance reliability was not improved and stress applied to achip was not reduced.

On the other hand, in Inventive Example 3, it may be confirmed that aband which did not include a resin was formed, so that there was no chipin which an IR deterioration defect occurred, among the 66 chips, evenwhen 4 mm of deformation was applied. From this, it may be confirmedthat moisture resistance reliability was improved, and stress applied toa chip was alleviated by a band electrode including a resin.

As described above, a band electrode, including a conductive metal and aresin, may be included to alleviate stress which may be applied to amultilayer electronic component during reflow or deformation of asubstrate.

In addition, an insulating layer may be disposed on a connectionelectrode of an external electrode and a plating layer may be disposedon a band electrode of the external electrode, thereby improvingreliability of a multilayer electronic component while increasingcapacitance per unit volume of the multilayer electronic component.

In addition, a mounting space of a multilayer electronic component maybe significantly reduced.

In addition, ESR or acoustic noise may be reduced.

While example embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including a plurality of dielectric layers and first and secondinternal electrodes disposed alternately with the dielectric layers in afirst direction and having first and second surfaces opposing each otherin the first direction, third and fourth surfaces connected to the firstand second surfaces and opposing each other in a second direction, andfifth and sixth surfaces connected to the first to fourth surfaces andopposing each other in a third direction; a first external electrodeincluding a first connection electrode, disposed on the third surface,and a first band electrode disposed on the first surface to be connectedto the first connection electrode; a second external electrode includinga second connection electrode, disposed on the fourth surface, and asecond band electrode disposed on the first surface to be connected tothe second connection electrode; a first insulating layer disposed onthe first connection electrode; a second insulating layer disposed onthe second connection electrode; a first plating layer disposed on thefirst band electrode; and a second plating layer disposed on the secondband electrode, wherein the first and second band electrodes include aconductive metal and a resin.
 2. The multilayer electronic component ofclaim 1, wherein the resin includes at least one selected from the groupconsisting of an epoxy resin, an acrylic resin, and ethyl cellulose. 3.The multilayer electronic component of claim 1, wherein the conductivemetal includes at least one of copper (Cu), nickel (Ni), silver (Ag),tin (Sn), and chromium (Cr).
 4. The multilayer electronic component ofclaim 1, wherein the first insulating layer is disposed to cover adistal end of the first plating layer disposed on the first externalelectrode, and the second insulating layer is disposed to cover a distalend of the second plating layer disposed on the second externalelectrode.
 5. The multilayer electronic component of claim 1, whereinH2≤H1, where H1 is an average size to an internal electrode, disposed tobe closest to the first surface in the first direction, among the firstand second internal electrodes, and H2 is an average size from anextension line of the first surface to distal ends of the first andsecond plating layers, disposed on the first and second connectionelectrodes, in the first direction.
 6. The multilayer electroniccomponent of claim 1, wherein the first and second plating layers aredisposed on a level the same or lower than a level of an extension lineof the first surface.
 7. The multilayer electronic component of claim 1,wherein H2>H1, where H1 is an average size to an internal electrode,disposed to be closest to the first surface in the first direction,among the first and second internal electrodes, and H2 is an averagesize from an extension line of the first surface to distal ends of thefirst and second plating layers, disposed on the first and secondconnection electrodes, in the first direction.
 8. The multilayerelectronic component of claim 1, wherein the first external electrodefurther includes a third connection electrode disposed on the thirdsurface to be disposed on the first connection electrode, the secondexternal electrode further includes a fourth connection electrodedisposed on the fourth surface to be disposed on the second connectionelectrode, the first insulating layer is disposed on the thirdconnection electrode, and the second insulating layer is disposed on thefourth connection electrode.
 9. The multilayer electronic component ofclaim 1, further comprising: an additional insulating layer disposed onthe first surface and disposed between the first band electrode and thesecond band electrode.
 10. The multilayer electronic component of claim9, wherein the additional insulating layer includes a resin and anadditive.
 11. The multilayer electronic component of claim 10, whereinthe resin, included in the additional insulting layer, includes at leastone selected from the group consisting of an epoxy resin, an acrylicresin, and ethyl cellulose.
 12. The multilayer electronic component ofclaim 10, wherein the additive, included in the additional insulatinglayer, includes at least one selected from the group consisting of SiO₂,TiO₂, BaTiO₃, BaO, Al₂O₃, and ZnO.
 13. The multilayer electroniccomponent of claim 1, further comprising: an additional insulating layerdisposed on the first surface, wherein the first and second bandelectrodes are disposed on the additional insulating layer.
 14. Themultilayer electronic component of claim 13, wherein the additionalinsulating layer includes a resin and an additive.
 15. The multilayerelectronic component of claim 14, wherein the resin, included in theadditional insulting layer, includes at least one selected from thegroup consisting of an epoxy resin, an acrylic resin, and ethylcellulose.
 16. The multilayer electronic component of claim 14, whereinthe additive, included in the additional insulating layer, includes atleast one selected from the group consisting of SiO₂, TiO₂, BaTiO₃, BaO,Al₂O₃, and ZnO.
 17. The multilayer electronic component of claim 1,further comprising: a margin portion disposed on opposite end surfacesof the body in the third direction, wherein the body includes an activeportion, including the first and second internal electrodes disposedalternately with the plurality of dielectric layers in the firstdirection, and a cover portion disposed on opposite end surfaces of theactive portion in the first direction.
 18. The multilayer electroniccomponent of claim 1, wherein a material of the first connectionelectrode is different from a material of the first band electrode, anda material of the second connection electrode is different from amaterial of the second band electrode.
 19. A multilayer electroniccomponent comprising: a body including a plurality of dielectric layersand first and second internal electrodes disposed alternately with thedielectric layers in a first direction and having first and secondsurfaces opposing each other in the first direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother in a second direction, and fifth and sixth surfaces connected tothe first to fourth surfaces and opposing each other in a thirddirection; a first external electrode including a first connectionelectrode, disposed on the third surface, and a first band electrodedisposed on the first surface to be connected to the first connectionelectrode; a second external electrode including a second connectionelectrode, disposed on the fourth surface, and a second band electrodedisposed on the first surface to be connected to the second connectionelectrode; a first plating layer disposed on the first externalelectrode; and a second plating layer disposed on the second externalelectrode, wherein the first and second band electrodes include aconductive metal and a resin.
 20. The multilayer electronic component ofclaim 19, wherein a material of the first connection electrode isdifferent from a material of the first band electrode, and a material ofthe second connection electrode is different from a material of thesecond band electrode.